Importance of Low PIM Components Webinar
The advent of wireless with its tightly grouped, high power, high frequency signals and the associated high sensitivity receivers has created many unanticipated PIM (Passive Intermodulation) problems. PIM is caused by improper design of the passive, sharing transmission line by the receive signal. This brief overview describes a few of the problems and solutions encountered by Microlab/FXR in its efforts to supply PIM-free wireless components.
Affordable Design Techniques for Broad-Band DAS Expansion
In this webinar, the concept of the Signal Tapper will be introduced. This webinar will also include an analysis of the performance characteristics and recommended design revisions that will enable tremendous cost savings without any sacrifice to over-all system performance.
DCC Series™ DAS Carrier Conditioners for In-Building DAS
This Webinar is designed for people who want to learn about the new approaches to In-Building Communications Systems. The primary focus will be on the carrier interface in the passive DAS. We will discuss a variety of approaches from both the component and integrated standpoint with special attention to the impact of Passive Intermodulation (PIM) which results from additional frequency deployment within the DAS.